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ISO 14692-2 Technical Corrigendum 1-2005 石油和天然气工业.玻璃增强塑料(GRP)管.第2部分:合格鉴定和制造.技术勘误1

上一篇: DIN EN 13673-2-2005 气体和蒸气的最大爆炸压力和最大压升速率的测定.第2部分:最大压升爆炸速率的测定.德文版本EN13673-2-2005
下一篇: ISO 857-2-2005 焊接和相关工艺.词汇.第2部分:软钎焊和铜焊工艺及相关术语

标准名称：	系统接地的型式及安全技术要求
英文名称：	Types and safety technical requirements of system earthing
中标分类：	电工 >> 电工综合 >> 卫生、安全、劳动保护
ICS分类：
替代情况：	替代GB 14050-1993
发布部门：	中华人民共和国国家质量监督检验检疫总局 中国国家标准化管理委员会
发布日期：	2008-09-24
实施日期：	2009-08-01
首发日期：	1993-01-04
作废日期：
主管部门：	国家标准化管理委员会
提出单位：	全国电气安全标准化技术委员会
归口单位：	全国电气安全标准化技术委员会
起草单位：	上海电动工具研究所、机械工业北京电工技术经济研究所、广东出入境检验检疫局技术中心等
起草人：	刘江、曾雁鸿、裴晓波、张萍、范一兵
出版社：	中国标准出版社
出版日期：	2009-08-01
页数：	11页
计划单号：	20062576-Q-469

本标准规定了系统接地的型式及安全技术要求，其目的是保障人和设备的安全。
本标准适用于系统标称电压为交流220／380V的电网。

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前言Ⅰ １　范围１ ２　规范性引用文件１ ３　术语和定义１ ４　系统接地的型式２ ４．１　ＴＮ 系统３ ４．２　ＴＴ 系统４ ４．３　ＩＴ 系统４ ５　对系统接地的安全技术要求５ ５．１　基本要求５ ５．２　ＴＮ 系统６ ５．３　ＴＴ 系统６ ５．４　ＩＴ 系统７

ＧＢ／Ｔ４７７６—２００８　电气安全术语
ＧＢ１３９５５　剩余电流动作保护装置安装和运行
ＧＢ１６８９５．３—２００４　建筑物电气装置　第５５４部分　电气设备的选择和安装　接地配置、保护导体和保护联结导体（ＩＥＣ６０３６４５５４：２００２，ＩＤＴ）

MIL-STD-883H, DEPARTMENT OF DEFENSE TEST METHOD STANDARD: MICROCIRCUITS (26 FEB 2010)., This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproducibility of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions. b. To describe in one standard all of the test methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices. c. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard.

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